Failure Analysis Engineer, Microelectronics (Starlink)

FAILURE ANALYSIS ENGINEER, MICROELECTRONICS (STARLINK)

Starlink is SpaceX’s ambitious goal to bring high-quality internet to the globe by building a constellation of thousands of satellites in low Earth orbit (LEO) using our Falcon 9 and Starship reusable rockets. We are developing millions of devices for end users to link our customers to our satellites.

As a Failure Analysis Engineer on the Starlink team, you will perform detailed root cause failure analysis on microelectronic components and packaging to support high-volume manufacturing, qualification, and field returns. You will leverage advanced laboratory tools and physics-of-failure techniques to identify failure mechanisms and drive corrective actions that improve the reliability of our satellite constellation and user terminals.

RESPONSIBILITIES:

• Own end-to-end root cause failure analysis investigations on microelectronics failing in manufacturing, test, and field, from initial failure characterization through final corrective action verification


• Conduct advanced electrical fault isolation and characterization using curve trace, TDR, RF characterization, Lock-in Thermography, OBIRCH, EBIRCH, EBAC, nanoprobing, and related techniques to precisely localize defects in complex devices


• Perform advanced physical failure analysis using SEM, FIB, EDS, SAM, cross-sectioning, and related techniques to identify failure mechanisms in silicon, packaging, and interconnects


• Apply physics-of-failure principles and deep knowledge of semiconductor failure modes (electromigration, thermal fatigue, delamination, EOS/ESD, solder joint fatigue, etc.) to determine root causes


• Drive corrective actions by working directly with silicon design, packaging, and manufacturing teams to implement and validate design or process changes based on FA findings


• Author detailed technical reports documenting failure modes, root cause conclusions, supporting data, and corrective action effectiveness


• Develop and improve failure analysis techniques and workflows to support new packaging technologies and advanced materials

BASIC QUALIFICATIONS:

• Bachelor’s degree in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline


• 2+ years of hands-on experience in microelectronics failure analysis or materials characterization (internship experience is applicable)

PREFERRED SKILLS AND EXPERIENCE:

• Master’s or PhD in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline with a focus on microelectronics or failure analysis


• Direct experience with failure analysis tools and techniques (SEM, FIB, EDS, cross-sectioning, fault isolation, or equivalent)


• Strong understanding of semiconductor physics and common microelectronics failure mechanisms (electromigration, thermal fatigue, delamination, solder joint fatigue, electrical overstress/ESD, etc.)


• Proficiency with advanced FA tools including SEM, FIB, SAM, and EDS


• Hands-on experience in electrical characterization and fault isolation techniques such as IV curves, RF/VNA measurement, LIT, OBIRCH, EBIRCH, EBAC, nanoprobing, photon emission, or voltage contrast


• Experience applying JEDEC and AEC reliability test standards and physics-of-failure methodologies to root cause investigations


• Experience analyzing complex datasets with Python, JMP, or similar tools


• Excellent problem-solving, communication, and technical writing skills

ADDITIONAL REQUIREMENTS:

• Ability to work overtime and weekends as needed


• Ability to work in a cleanroom or ESD-controlled environment when required